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Additive manufacturing, otherwise known as three-dimensional (3D) printing, is a rapidly growing technique that is increasingly used for the production of polymer products, resulting in an associated increase in plastic waste generation. Waste from a particular class of 3D-printing, known as vat photopolymerization, is of particular concern, as these materials are typically thermosets that cannot be recycled or reused. Here, we report a mechanical recycling process that uses cryomilling to generate a thermoset powder from photocured parts that can be recycled back into the neat liquid monomer resin. Mechanical recycling with three different materials is demonstrated: two commercial resins with characteristic brittle and elastic mechanical properties and a third model material formulated in-house. Studies using photocured films showed that up to 30 wt% of the model material could be recycled producing a toughness of 2.01 ± 0.55 MJ/m3, within error of neat analogues (1.65 ± 0.27 MJ/m3). Using dynamic mechanical analysis and atomic force microscopy-based infrared spectroscopy, it was determined that monomers diffuse into the recycled powder particles, creating interpenetrating networks upon ultraviolet (UV) exposure. This process mechanically adheres the particles to the matrix, preventing them from acting as failure sites under a tensile load. Finally, 3D-printing of the commercial brittle material with 10 wt% recycle content produced high quality parts that were visually similar. The maximum stress (46.7 ± 6.2 MPa) and strain at break (11.6 ± 2.3%) of 3D-printed parts with recycle content were within error the same as neat analogues (52.0 ± 1.7 MPa; 13.4 ± 1.8%). Overall, this work demonstrates mechanical recycling of photopolymerized thermosets and shows promise for the reuse of photopolymerized 3D-printing waste. 

Key properties of two-dimensional (2D) layered materials are highly strain tunable, arising from bond modulation and associated reconfiguration of the energy bands around the Fermi level. Approaches to locally controlling and patterning strain have included both active and passive elastic deformation via sustained loading and templating with nanostructures. Here, by float-capturing ultrathin flakes of single-crystal 2H-MoS₂ on amorphous holey silicon nitride substrates, we find that highly symmetric, high-fidelity strain patterns are formed. The hexagonally arranged holes and surface topography combine to generate highly conformal flake-substrate coverage creating patterns that match optimal centroidal Voronoi tessellation in 2D Euclidean space. Using TEM imaging and diffraction, as well as AFM topographic mapping, we determine that the substrate-driven 3D geometry of the flakes over the holes consists of symmetric, out-of-plane bowl-like deformation of up to 35 nm, with in-plane, isotropic tensile strains of up to 1.8% (measured with both selected-area diffraction and AFM). Atomistic and image simulations accurately predict spontaneous formation of the strain patterns, with van der Waals forces and substrate topography as the input parameters. These results show that predictable patterns and 3D topography can be spontaneously induced in 2D materials captured on bare, holey substrates. The method also enables electron scattering studies of precisely aligned, substrate-free strained regions in transmission mode. 

Bio/ecoresorbable electronic systems create unique opportunities in implantable medical devices that serve a need over a finite time period and then disappear naturally to eliminate the need for extraction surgeries. A critical challenge in the development of this type of technology is in materials that can serve as thin, stable barriers to surrounding ground water or biofluids, yet ultimately dissolve completely to benign end products. This paper describes a class of inorganic material (silicon oxynitride, SiON) that can be formed in thin films by plasma‐enhanced chemical vapor deposition for this purpose. In vitro studies suggest that SiON and its dissolution products are biocompatible, indicating the potential for its use in implantable devices. A facile process to fabricate flexible, wafer‐scale multilayer films bypasses limitations associated with the mechanical fragility of inorganic thin films. Systematic computational, analytical, and experimental studies highlight the essential materials aspects. Demonstrations in wireless light‐emitting diodes both in vitro and in vivo illustrate the practical use of these materials strategies. The ability to select degradation rates and water permeability through fine tuning of chemical compositions and thicknesses provides the opportunity to obtain a range of functional lifetimes to meet different application requirements.